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Gembird TG-G3.0-01 heat sink compound 4.5 W/m·K 3 g
SKU
TG-G3.0-01

£15.55
£12.96
In Stock
Heatsink thermal paste grease, 3 g weight
Secure fast payment on this purchase
Free delivery on orders over £100
- Keep your computer's CPU cool
- Practical syringe for easy application
SKU | TG-G3.0-01 |
---|---|
EAN | 8716309083133 |
Manufacturer | Gembird |
Availability | Y |
Features | |
---|---|
Thermal resistance | 0.205 °C/W |
Viscosity note | 76 CPS |
Thermal conductivity | 4.5 W/m·K |
Operating temperature (T-T) | -50 - 240 °C |
Product colour | Grey |
Technical details | |
Compliance certificates | RoHS |
Thermal resistance | 0.205 °C/W |
Viscosity note | 76 CPS |
Thermal conductivity | 4.5 W/m·K |
Operating temperature (T-T) | -50 - 240 °C |
Weight & dimensions | |
Width | 120 mm |
Depth | 180 mm |
Height | 15 mm |
Weight | 3 g |
Package width | 120 mm |
Package depth | 180 mm |
Package height | 15 mm |
Package weight | 33 g |
Packaging data | |
---|---|
Package width | 120 mm |
Package depth | 180 mm |
Package height | 15 mm |
Package weight | 33 g |
Operational conditions | |
Operating temperature (T-T) | -50 - 240 °C |
Colour | |
Product colour | Grey |
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---|---|---|---|---|---|---|
SKU |
TG-G3.0-01
|
HTK-002-U1-GP
|
ACTCP00001B
|
AK-TCW-02
|
TG-G15-02
|
ACTCP00059A
|
Description |
Thermal compund (grease) for heatsinks
Helps the heat dissipation from a CPU, chipset or processor to a heatsink Excellent thermal impedance Perfect stability - will not separate, run, migrate, or bleed Non capacitive or electrically conductive |
Cooler Master HTK-002 thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 177oC (350oF), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.
|
Optimised Packaging Saves Resources
A sustainable use of resources is really important for us at ARCTIC Thus we updated the packaging of the MX-4 to minimize it's CO2 Footprint. The practical, recyclable packaging bag of our thermal compound helps us to reduce the environmental impact of packaging materials by about 40% and thereby save resources. Better than Liquid Metal The ARCTIC MX-4 compound is composed of carbon micro-particles which lead to an extremely high thermal conductivity. It guarantees that heat generated from the CPU or GPU is dissipated quickly and efficiently. Superb in performance, MX-4 is the best companion for overclockers and enthusiasts. Easy to Apply With an ideal consistency, the MX-4 is very easy to use, even for beginners. The possibilities for its application and the most effectively way to avoid voids between CPU and cooler we show you in the video. Safe Application It does not contain any metallic particles so electical conductivity would not be an issue. Unlike silver and copper compound, it ensures that contact with any electrical pins would not result in damage of any sort. High Durability In contrast to metal and silicon thermal compound, the performance of MX-4 does not compromise over time. Once applied, you do not need to apply it a second time as it will last at least for 8 years. Value for Money A high performance thermal compound perfect for system builders, there's no suprise that the MX-4 exceeds your expectations for its low price tag. |
No
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Thermal silicone compound (grease) for heatsinks
Helps the heat dissipation from a CPU, chipset or processor to a heatsink Excellent thermal impedance Perfect stability - will not separate, run, migrate, or bleed Non capacitive or electrically conductive |
Ensure optimum thermal conductivity with our award winning thermal interfaces. Well known for its outstanding quality, our high-performance MX thermal compound is a regular winner in performance tests. It has extremely high thermal conductivity and is easy to apply, even for beginners. Thermal pads in various designs and sizes round out the product range.
|
Short Description |
Heatsink thermal paste grease, 3 g weight
|
0.8 °C/W, 550 volts/mil, 21.7 kV/mm
|
20 g, 8.5 W/mK, 2.50 g/cm³, 3.8 x 1013 Ω-cm, 33 g
|
Akasa TIM Wipes | Thermal Paste Remover | Citrus-based Solvent | 10pcs | Tech for Techs Recommended | Ideal for CPU, GPU, Heatsink and Chipset | AK-TCW-02
|
Heatsink silicone thermal paste grease, 15 g
|
MX-4 Highest Performance Thermal Compound, 8 g + Spatula
|
Manufacturer |
Gembird
|
Cooler Master
|
ARCTIC
|
Akasa
|
Gembird
|
ARCTIC
|